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FCR,
RCA, RCN Series are formed by vacuum depositing
a resistive alloy on a usually flat substrate of
ceramic. Photo-lithographic or similar
techniques are used to define the final geometry
and interconnecting traces. This technology
provides for close ratio matching and tracking
in a network, as well as low stand-alone
temperature coefficient and resistance
tolerance. Types includes precision smd (FCR),
smd array (RCA), and networks (RCN). |
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